http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1070371-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1996-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6db4bf12ffc6a5541574b21332bb719 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27cd6d1cbb9804ab8545c29552c35efa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_139bbe7636edf8b3a291c4fa5b809b5e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc8348e466c0947992addfc6c83b8a4b |
| publicationDate | 1998-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1070371-A |
| titleOfInvention | Method for manufacturing multilayer wiring board |
| abstract | PROBLEM TO BE SOLVED: To manufacture a multilayer wiring board having excellent adhesion between an interlayer insulating layer and a plated conductive layer, high heat resistance, environmentally safe, highly reliable, and improved manufacturing efficiency. Provide a method inexpensively. SOLUTION: At least one surface of a substrate has a plurality of wiring patterns and an interlayer insulating layer, and a via hole for electrically connecting the wiring patterns to each other is provided at a predetermined position of the interlayer insulating layer. In the method for manufacturing a multilayer wiring board, when providing the via hole, a film having sandblast resistance is pattern-formed on the interlayer insulating layer, and then the interlayer insulating layer is selectively removed by performing sandblasting. A method for manufacturing a multilayer wiring board, comprising: forming a via hole, removing a film having sandblast resistance, and then directly applying an electrolytic plating process to provide a conductive layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004323885-A |
| priorityDate | 1996-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 312.