http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1070128-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_526ae2f0ddf1d79cdf98d132ad9282e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 1997-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_179f64aae60aa6e93778d0ee7f6c8258 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22cf9091f001d677aafb9a8cf1360d7c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fd1f3dccf7181d3b1594f0e051c24c2 |
| publicationDate | 1998-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1070128-A |
| titleOfInvention | Method for producing palladium contact bumps on semiconductor circuit carriers |
| abstract | PROBLEM TO BE SOLVED: To provide a method for producing a uniformly thick palladium contact bump on an aluminum surface of a semiconductor circuit carrier so that the bump can be surely and firmly deposited on the aluminum surface. SOLUTION: The surface of the conductor structure on the chip is firstly cleaned and then optionally treated with an aqueous solution containing zinc ions, then with an acidic activating solution containing palladium ions, The contact bumps are formed on the treated conductor structure by a currentless palladium deposition bath having a pH value of 4 to 7 containing palladium ion, formic acid or a formic acid derivative as a reducing agent and a nitrogen-containing complexing agent for palladium ions. Thus, such palladium bumps are formed by currentless metallization with palladium. |
| priorityDate | 1996-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.