| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
1996-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f181dc31298ec8d21d45cb27212c798b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29183f7044fcb78bb70966fca237d63a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08ac9716e7d302830be438e262f25424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f73c4c24267354c5c06b8d409fadf421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aae35393c797d299838a5d1484cddb96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4661976a16b2ae37502dff7dac60e02 |
| publicationDate |
1998-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H1067919-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device using the same |
| abstract |
(57) [Problem] To provide an epoxy resin composition which is excellent in peeling resistance and crack resistance during mounting and excellent in storage stability when mounting electronic equipment, and a semiconductor device obtained by using the same. I do. A semiconductor device in which a semiconductor element is sealed using an epoxy resin composition containing the following (A) and (B) as essential components. (A) An inorganic filler having an aminoalkylalkoxysilane fixed on its surface. (B) Microcapsules containing a hardening accelerator having a core / shell structure in which a core made of a hardening accelerator is covered with a shell made of a thermoplastic resin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6506494-B2 |
| priorityDate |
1996-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |