http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1065478-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24461d63db51630fb1930da1e2710b92 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-19 |
filingDate | 1996-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_432ada38dee1e7063e354e189e418077 |
publicationDate | 1998-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H1065478-A |
titleOfInvention | Support structure of piezoelectric vibration device |
abstract | (57) [Problem] To easily position a conductive bonding material, prevent the conductive bonding material from flowing out of the support, and Provided is a support structure for a piezoelectric vibration device in which the bonding strength (adhesion) of a conductive bonding material is improved. SOLUTION: A base 2 on which lead terminals 22 and 23 are implanted insulated from each other, support bodies 24 and 26 attached to the respective lead terminals, and a piezoelectric diaphragm having excitation electrodes formed on the front and back surfaces. 10, at least a conductive bonding material S for electromechanically bonding the support body and the piezoelectric vibration plate, and a cap 3 for hermetically sealing the piezoelectric vibration plate, In a support structure of a piezoelectric vibration device in which the piezoelectric vibration plate is mounted perpendicular to the plane of the support, a rough surface 24a is formed at least on a portion of the support where the conductive bonding material is applied. did. |
priorityDate | 1996-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.