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publicationDate 1998-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1060370-A
titleOfInvention Resin composition for laminate and copper-clad laminate using the same
abstract PROBLEM TO BE SOLVED: To provide a resin composition containing a vinyl ester resin and a radical polymerizable monomer, having a high interlayer adhesion strength, and capable of obtaining a laminate which is hardly discolored when heated. And a copper-clad laminate using the resin composition. SOLUTION: Styrene, alkyl acrylate, A resin composition containing a polymer (C) having a weight average molecular weight of 3,000 to 12,000, which is obtained by reacting acrylic acid and / or methacrylic acid. Further, as the vinyl ester resin (A), a polymer (C) having a weight average molecular weight of 3,000 to 12,000 obtained by reacting styrene, an alkyl acrylate, and acrylic acid and / or methacrylic acid, and an epoxy resin; A resin composition containing a resin obtained by reacting acrylic acid and / or methacrylic acid. A copper-clad laminate obtained by integrating a copper foil with an impregnated product obtained by impregnating a substrate with any one of the above resin compositions.
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