| abstract |
(57) [Summary]nPROBLEM TO BE SOLVED: To have high heat resistance, low moisture absorption and low stress. Epoxy for semiconductor encapsulation that can give excellent cured products Provide a resin composition.nSOLUTION: (a) A switch represented by the following general formula (I) Pyrochroman skeleton-containing epoxy resin, (b) phenol Based and / or modified phenolic epoxy resin curing agents, (C) a curing accelerator and (d) an inorganic filler are essential components An epoxy resin composition for semiconductor encapsulation, which is blended as:nEmbedded imagen (Where R 1 , R Two , R Three And R Four Is a hydrogen atom or charcoal Represents a hydrocarbon group with a prime number of 1 to 6, It may be. R Five , R 6 , R 7 , R 8 , R 9 as well as R Ten Is a hydrogen atom, a halogen atom or a carbon atom having 1 to 6 carbon atoms. Represents a hydride group and may be the same or different No. N is an average value of 0 to 5) |