| abstract |
(57) [Summary]n(A) containing 95 to 15% by weight of a telechelic polymer and 5 to 85% by weight of a heterotelechelic polymer, wherein at least one of the functional groups of the heterotelechelic polymer is the same as the functional group of the telechelic polymer; The polymer system, and (b) one component of the curing system cures the telechelic polymer at ambient temperature to produce a pressure sensitive adhesive or sealant, while the other component forms a telechelic during baking at least 100 ° C. A pressure-sensitive structural adhesive composition and a pressure-sensitive structural sealant composition having a dual curing system that forms a structural adhesive composition or a sealant composition by curing a polymer. In one preferred embodiment, the polymer system comprises a hydroxyl functional telechelic diol or polyol polymer, and the heterotelechelic polymer is a monohydroxylated polydiene polymer also having epoxidized olefin functional groups. The double-curing system preferably contains an isocyanate-based curing agent and an amino resin, and the former forms a pressure-sensitive adhesive or sealant by curing through a hydroxyl group at an ambient temperature, and the latter is used during baking. Curing via the epoxy functionality creates a structured adhesive or sealant. |