abstract |
(57) [Summary] [PROBLEMS] To be excellent in flexibility, adhesiveness, solder heat resistance and chemical resistance, and also excellent in heat aging resistance and storage stability, Provided is an adhesive composition suitable as an adhesive for a flexible printed circuit board. (A) An ethylene-acrylic copolymer, An adhesive composition comprising (B) a glycidyl ether-type epoxy resin, (C) a glycidylamine-type epoxy resin having two or more glycidyl groups in a molecule and having one or more benzene nuclei, and (D) a curing agent. |