abstract |
(57) Abstract: One side of a packaging base material is cured by heat and / or light mainly containing a copolymer of ethylene, vinyl acetate, maleic acid and / or maleic anhydride. A packaging material formed by forming a cured layer of a conductive adhesive composition. The packaging material of the present invention has a very high sealing strength in the sealing layer, and is suitably used for food packaging and the like. |