| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2175de8bcadd3c1447a15ba8b57051c6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0508
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-956
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-88 |
| filingDate |
1998-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c14e940fbff15036d97d7308f16077d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad2e51426a64f061eb34725a68f7309d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8f278e74eb4e1e2fa19343e5cdb2ed5 |
| publicationDate |
1998-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10335364-A |
| titleOfInvention |
Method for manufacturing flip-chip mounted solder bump of semiconductor device, solder bump manufactured by the method, and method for analyzing the same |
| abstract |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flip-chip mounted solder bump of a semiconductor device for using an alloy of silver and tin for a solder bump, a solder bump manufactured thereby, and a method of analyzing the same. . SOLUTION: The present invention relates to a method of manufacturing a flip chip mounting type solder bump of a semiconductor device for mounting on a circuit board or the like on which a pattern has already been formed according to the characteristics of an element. Formation stage; (2) a photo process step; (3) a plating step of sequentially plating silver and tin on a region where the photoresist has been removed in the photo process of (2); (4) a removing step of completely removing the photoresist; (5) an etching step for etching the boundary film; and (6) a reflow process to perform the above (3). A silver alloy and a tin alloy sequentially formed by plating are formed in an alloy in a predetermined ratio. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006237159-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012142557-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010087335-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002324776-A |
| priorityDate |
1997-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |