http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10330714-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate 1997-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ef3ceca090e7dc42db25e360025571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c240c627796a21e546d8b32d38f9dc
publicationDate 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10330714-A
titleOfInvention Conductive resin paste and semiconductor device manufactured using the same
abstract (57) [Problem] To provide a conductive resin paste which does not generate voids due to resin popping during curing. SOLUTION: (A) silver powder containing 0.1 to 3% by weight of stearic acid ester in total silver powder and having a specific surface area of 0.8 mm 2 / g or more and a maximum particle size of 30 μm or less, (B) epoxy liquid at room temperature Resin is an essential component and the total silver content is 60 to 85% by weight, and the silver powder of the component (A) is 1% of the total silver component. A conductive resin paste characterized by being 0 to 100% by weight, and a semiconductor device manufactured using the conductive resin paste.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007265801-A
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