http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10330583-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 |
| filingDate | 1997-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13ea52b59e3fa7d47d9106a5d5d7ff8c |
| publicationDate | 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10330583-A |
| titleOfInvention | Phenolic resin composition |
| abstract | (57) [Summary] A phenolic resin composition which is a flame retardant containing no halogen element, has excellent moisture resistance, heat resistance, flame retardancy, and electrical properties, and is suitable for molding electronic parts. Phenolic resin molding material. SOLUTION: Phenol formaldehyde resin 10 5 parts by weight of inorganic filler that dissociates water of crystallization -20 weight parts and melamine cyanurate in 3-20 Using a phenolic resin composition containing parts by weight as a molding material, Form into electronic parts and the like. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6554936-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100758748-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100660082-B1 |
| priorityDate | 1997-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.