http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10330459-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1997-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4b9f8d5260ab980ad1a17f3cbe15ec9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811ab8641038f3084fcbbf2559147976 |
| publicationDate | 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10330459-A |
| titleOfInvention | Epoxy resin molding material for sealing electronic parts and electronic parts |
| abstract | (57) Abstract: Provided is an epoxy resin molding material for electronic parts encapsulation which has excellent fluidity and moldability and has improved reflow crack resistance. A curing agent containing (A) an epoxy resin, (B) a modified phenol resin obtained by reacting a phenol with a condensed polycyclic aromatic hydrocarbon and an aldehyde, and (C) an indene oligomer And (D) an epoxy resin molding material for electronic component encapsulation containing an inorganic filler as an essential component. |
| priorityDate | 1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 94.