| abstract |
(57) Abstract: An object of the present invention is to provide a low-cost gold-silver alloy thin wire containing high-concentration silver and having high bonding reliability in bonding with an aluminum electrode. It is in. SOLUTION: A gold-silver alloy thin wire containing Ag in a range of 11 to 18.5% by weight. Further above and A g, (b) at least one of Cu, Pd and Pt in a total amount of 0.01 to 4% by weight, or (c) Ca, I n, at least one of the rare earth elements is 0.0005 in total A gold-silver alloy fine wire containing at least one selected from the group consisting of at least one of Mn and Cr in a range of 0.01 to 0.2% by weight, or a combination of (d) at least one of Mn and Cr. |