| abstract |
(57) [Summary] [PROBLEMS] In a conductive paste capable of being soldered, Oxidation resistance, migration resistance, adhesive strength, printability, Provided is a solderable conductive paste which maintains basic performance such as sedimentation resistance, and in particular, improves solderability to the same level as copper foil. SOLUTION: The general formula Ag x Cu y (provided that 0.00 x 1 ≦ x ≦ 0.4, 0.6 ≦ y ≦ 0.999, x + y = 1 (Atomic ratio)), wherein the copper alloy powder has a region where the silver concentration on the particle surface is higher than the average silver concentration of the particles, wherein the average particle diameter of the copper alloy powder is 5 to 35 μm. In a conductive paste containing 100 parts by weight of copper alloy powder and at least one or more resin binders and solvents, 0.001 to 10 parts by weight of a higher fatty acid and / or a higher fatty acid ester as a solderability improver is contained. And a conductive coat capable of being soldered. |