| abstract |
(57) [Abstract] (Modified) [PROBLEMS] In addition to the inherent heat resistance of a polyimide-based polymer, photocurability, low moisture absorption, solubility in a low boiling point solvent, and photosensitivity with high light transmittance Provide heat resistant resin. SOLUTION: A group represented by the following formula (8) or / and the formula (9) is mainly bonded to a polyimide polymer having a repeating unit represented by the following formula (1). |