http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10294266-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C11-08
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filingDate 1997-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9f115559b6b8a78943e98b76e20ef96
publicationDate 1998-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10294266-A
titleOfInvention Resist film forming method, chuck used therefor, and drying device
abstract (57) [Problem] To provide a method for forming a resist film having few surface irregularities. A resist is dropped on the wafer while rotating the wafer (step 102), and the rotation of the wafer is stopped before the resist coating film formed on the wafer dries (step 103). With the rotation of the wafer stopped, the resist coating film is forcibly dried to change to a resist film (step 104).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100517547-B1
priorityDate 1997-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.