Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1926159cf6ea47836a5109402d6c8677 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-40 |
filingDate |
1997-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9f115559b6b8a78943e98b76e20ef96 |
publicationDate |
1998-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H10294266-A |
titleOfInvention |
Resist film forming method, chuck used therefor, and drying device |
abstract |
(57) [Problem] To provide a method for forming a resist film having few surface irregularities. A resist is dropped on the wafer while rotating the wafer (step 102), and the rotation of the wafer is stopped before the resist coating film formed on the wafer dries (step 103). With the rotation of the wafer stopped, the resist coating film is forcibly dried to change to a resist film (step 104). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100517547-B1 |
priorityDate |
1997-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |