| abstract |
(57) Abstract: Bisalkenyl-substituted nadimide compounds, Bismaleimide compound, epoxy resin liquid at room temperature After heating and melting at 30 to 160 ° C., the mixture is cooled to 120 ° C. or less, and a radical polymerizable monomer is added. A resin composition for impregnation comprising, after cooling to the following temperature, adding and dissolving a monomaleimide compound, and finally adding an organic peroxide polymerization catalyst and a cationic polymerization catalyst having a heat latent property at a temperature of 80 ° C. or lower. [Effect] A resin composition having excellent low viscosity, heat resistance, pot life, and storage stability, which is suitable for impregnating applications of insulating materials for electric devices, particularly transformers and rotating machines, can be obtained. |