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publicationDate 1998-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10289968-A
titleOfInvention Power semiconductor device
abstract (57) Abstract: In an insulating module type power semiconductor device, the stress generated in an aluminum nitride ceramic substrate is reduced. A small pattern that is not electrically connected is formed in a vacant area on the front side of an aluminum nitride ceramic substrate. [Effect] Since the stress is balanced with the back surface, stress generation can be reduced.
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