http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10287861-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate | 1997-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a9596cf61231ca14c0c6369c74ddcc0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_714d62ce42690127f6a3d4eb7388a833 |
| publicationDate | 1998-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10287861-A |
| titleOfInvention | Adhesive for electroless plating and printed wiring board |
| abstract | (57) [Summary] [PROBLEMS] To reduce the light transmittance of an adhesive layer, To provide an adhesive for electroless plating excellent in leveling property and defoaming property. SOLUTION: An adhesive for electroless plating in which cured heat-resistant resin particles soluble in an acid or an oxidizing agent are dispersed in an uncured heat-resistant resin matrix which becomes hardly soluble in an acid or an oxidizing agent by the curing treatment. In the above, there is provided an adhesive for electroless plating, wherein the heat-resistant resin matrix contains a silicone oil. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001323244-A |
| priorityDate | 1997-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.