http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10284540-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1997-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60df2bdbe95997d5a6961c5952fd207c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f36a0cf9a71f30c5493deb32d6bded6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b344ebda833f35c456ad3dc1709a6f51 |
| publicationDate | 1998-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10284540-A |
| titleOfInvention | Support substrate, manufacturing method of support substrate, electronic component device, and surface treatment method of support substrate |
| abstract | (57) [Summary] [Object] To improve the reflow crack resistance due to a bonding material by increasing the adhesive force between an electronic component and a supporting substrate. A support substrate (lead frame, insulating substrate, etc.) on which electronic components (semiconductor chips, transistors, etc.) are mounted is placed in a solution containing 0.001 to 10% by weight of urea or a derivative thereof for 0.5 seconds to 10 seconds. Soak for a minute, remove it and dry while heating. A semiconductor chip is bonded to the obtained surface-treated support substrate using an organic bonding material (such as a silver paste or a film-like adhesive containing a silver filler). As the urea derivative, γ-carbamylpropyltriethoxysilane, dimethylurea formamide and the like can be used. |
| priorityDate | 1997-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.