http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10284445-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_250d7d24d096f307230e703f0ddc2275 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02646fc44a50834bf042173678f48e7c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c647652ea7c838546d47bb9c0103a848 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c78ca6524bee8cc1ea700956772c7b3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef5d89f73a0be74690b001f6a9a7028 |
| publicationDate | 1998-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10284445-A |
| titleOfInvention | Dicing method for semiconductor wafer |
| abstract | [PROBLEMS] When a semiconductor wafer is diced, not only the wafer but also the ultraviolet curable adhesive is cut, so that the rotary blade is clogged (adhesive adheres between the blades). thing) This causes a problem that the rotary blade must be replaced frequently. The conventional method of dicing a semiconductor wafer by attaching it to an ultraviolet-curable adhesive before ultraviolet curing, The semiconductor wafer vibrates due to the elastic force of the adhesive, There is a problem that the chipping property (the degree to which the semiconductor wafer is chipped without chipping during dicing) is low. In a dicing method for a semiconductor wafer, the method includes a step of attaching a semiconductor wafer to an ultraviolet curable adhesive laminated on a sheet, and a step of dicing the semiconductor wafer attached to the sheet. An ultraviolet irradiation step is provided between the combining step and the dicing step to perform ultraviolet irradiation on the ultraviolet-curable pressure-sensitive adhesive. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010272855-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003007646-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005051229-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4578165-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002201442-A |
| priorityDate | 1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.