http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10279668-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0cdb395105a75f1b0346cc31b81fade1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1997-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00d1abd4a48339aba78156469da28ec3 |
| publicationDate | 1998-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10279668-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in fluidity, moldability, moisture resistance reliability and solder stress resistance. SOLUTION: A crystalline epoxy compound having a melting point of 50 to 150 ° C, an alkylbenzene (X) represented by the general formula (1) and an aldehyde (Y1) represented by the general formula (2). Is reacted in the presence of an acid catalyst with an alkylbenzene-aldehyde resin (W) and a phenol (Z) represented by the general formula (3) at a weight ratio of 1 ≦ (Z) / (W) ≦ 20, After polycondensation in the presence of a catalyst, the phenol / alkylbenzene / aldehyde resin obtained by further reacting the aldehyde (Y2) represented by the general formula (2) has a hydroxyl equivalent of 100 to 200 g / eq and a softening point of 60-110 Solution viscosity at 20 ° C. and 25 ° C. is 20 to 90 μm 2 / s, the weight average molecular weight is 400 to 3000, and the resin is contained in the entire resin curing agent in an amount of 30 to 100% by weight, an inorganic filler and a curing accelerator An epoxy resin composition for semiconductor encapsulation, comprising: Embedded image Embedded image Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001310931-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001114872-A |
| priorityDate | 1997-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.