http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10279661-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1997-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a2ddd996b6f15e904d4e4eb2fd8c3f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce37a0a5c8063e44f6c52a0b7a2fed3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fafbe833382bbc30babb4740273ad3d |
| publicationDate | 1998-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10279661-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Abstract] [Problem] Reliability such as solder crack resistance and peeling resistance, Another object of the present invention is to provide a resin composition for semiconductor encapsulation which has excellent moldability such as fluidity during molding, curability, and releasability from a mold. The epoxy resin composition contains an epoxy resin (A), a phenolic curing agent (B), a curing accelerator (C) comprising an organic phosphine, and an inorganic filler (D). (A) has two or more epoxy groups, has two or more aromatic rings between at least two epoxy groups, and has at least two aromatic rings between at least two aromatic rings. An epoxy resin composition containing an epoxy resin having a structure having at least one carbon-carbon double bond. |
| priorityDate | 1997-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.