| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10d7da945fdf9f9478fa03b25bec2341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0753218c46835e9b576fdafda491dba6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fc0db7fc6ff92243ecaa5a4fcf1c54f |
| publicationDate |
1998-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10275789-A |
| titleOfInvention |
Abrasive and polishing method |
| abstract |
(57) Abstract: A polishing agent for polishing a metal film coated on a silicon wafer by chemical mechanical polishing, which has a polishing rate required for actual semiconductor device manufacturing. And a polishing method that can improve productivity in semiconductor manufacturing such as a reduction in product yield, and a polishing method using the polishing agent. An abrasive for polishing a metal film coated on a silicon wafer by chemical mechanical polishing, A polishing agent containing a complexing agent that reacts with a metal to form a water-soluble metal complex, and a polishing method for polishing a metal film coated on a silicon wafer by chemical mechanical polishing, wherein the polishing is performed as the polishing agent. Polishing method using an agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6676484-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008155368-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100412996-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6800105-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100433776-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006319353-A |
| priorityDate |
1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |