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filingDate 1997-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1338f52f52089b54a15878092f97f710
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publicationDate 1998-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10265637-A
titleOfInvention Resin composition and resin molded product
abstract PROBLEM TO BE SOLVED: To provide a resin composition and a resin molded product which can be easily polymerized and cured and provide a resin molded product excellent in thermal shock resistance. SOLUTION: The unsaturated polyester or vinyl ester (A) is 30 to 50% by weight and has a number average molecular weight of 50,000. It is a resin composition composed of 10 to 25% by weight of an acrylic resin (B) of up to 200,000 and 25 to 60% by weight of a radical polymerizable monomer (C) in total of 100% by weight. A resin molded article obtained by curing a curable resin composition containing 100 parts by weight of the composition and 50 to 300 parts by weight of a hydrated inorganic filler.
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