http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10264113-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 |
| filingDate | 1997-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda39649521f1b3920037eb110f84b75 |
| publicationDate | 1998-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10264113-A |
| titleOfInvention | Substrate processing method |
| abstract | (57) [Problem] To provide an effective method for treating a substrate containing a formaldehyde-emitting resin and reduce the amount of formaldehyde emitted from the substrate. SOLUTION: A substrate 1 is first irradiated with ionizing radiation 4, and thereafter, a paint containing a formaldehyde scavenger is applied to the surface of the substrate 1. Irradiation of ionizing radiation 4 promotes divergence and release of formaldehyde from substrate 1, and subsequently forms a coating film containing a formaldehyde scavenger so that the coating film captures formaldehyde released from substrate 1. To remove it. It does not affect the performance of the substrate itself, nor does it affect the suitability of substrate manufacture and post-processing. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008534325-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009544493-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007177255-A |
| priorityDate | 1997-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.