http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10264112-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27M3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00
filingDate 1997-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda39649521f1b3920037eb110f84b75
publicationDate 1998-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10264112-A
titleOfInvention Substrate processing method
abstract (57) [Problem] To provide an effective method for treating a substrate containing a formaldehyde-emitting resin and reduce the amount of formaldehyde emitted from the substrate. SOLUTION: A substrate 1 is first irradiated with ionizing radiation 4, and thereafter, a laminating sheet mainly composed of a resin having gas barrier properties and containing a formaldehyde scavenger is bonded and laminated on at least one of the front and back surfaces of the substrate. I do. Irradiation of the ionizing radiation 4 promotes the emission and release of formaldehyde from the substrate 1, and the subsequent attachment of a laminating sheet causes the sheet to capture and remove the formaldehyde released from the substrate 1. The laminating sheet is used as it is laminated on the substrate surface. It does not affect the performance of the substrate itself, nor does it affect the suitability of substrate manufacture and post-processing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104069993-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104069993-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010076449-A
priorityDate 1997-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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