http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10259293-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1998-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cf665b70f80b98542ae3dbe16d754f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a0842b630962ea1d763412ceaab84fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42449f9ac7f28d44e66493d88b9bd721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5936f9e0d045fc1203eb89014238a24c |
| publicationDate | 1998-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10259293-A |
| titleOfInvention | Resin-sealed semiconductor device, method for manufacturing the same, and epoxy resin composition for sealing the same |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor device in which the outside of a sufficient portion of a sealing resin is surrounded by another member, the adhesion of the sealing resin, the reduction in the amount of warpage of the semiconductor device, the thermal cycle property, the popcorn resistance. Provided are a resin-encapsulated semiconductor device having excellent properties, a method for producing the same, and an epoxy resin composition for encapsulation. SOLUTION: An e-semiconductor element 1 mounted on a wiring board 2a is provided. In a semiconductor device in which a frame 2b is arranged around a resin-filled space via a resin-filled space, and the resin-filled space is filled with an epoxy resin composition 3, the epoxy resin composition is obtained by mixing a curing agent and an inorganic filler with an epoxy resin. The composition has a flexural modulus at 23 ° C. of 10 GPa or less at 23 ° C. The coefficient of linear expansion from to the glass transition temperature is 10 × 10 -6 / A resin-encapsulated semiconductor device characterized by K〜40 × 10 −6 / K, a method for producing the same, and an epoxy resin composition for encapsulation. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007026499-A1 |
| priorityDate | 1997-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.