http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10259235-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 1997-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce37a0a5c8063e44f6c52a0b7a2fed3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93c7bb14b52afa7cb92fbc2dd06c292d |
| publicationDate | 1998-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10259235-A |
| titleOfInvention | Resin-sealed semiconductor device |
| abstract | (57) [Object] To provide an epoxy resin composition which is excellent in adhesion and reliability while miniaturizing a resin-encapsulated semiconductor device, and a semiconductor device encapsulated with the epoxy resin composition. A semiconductor element, a wiring board on which the semiconductor element is mounted, a frame disposed on the wiring board so as to surround the semiconductor element in a separated state, the semiconductor element, and the wiring A semiconductor device comprising a cured product of an epoxy resin composition 3 filled in a resin filling portion surrounded by a substrate 2a and a frame 2b, wherein the epoxy resin composition comprises an epoxy resin (A) and a curing agent (B ), Inorganic filler (C) And a silane-modified polymer (D). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004003989-B4 |
| priorityDate | 1997-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.