| abstract |
PROBLEM TO BE SOLVED: To provide a positive heat-resistant photosensitive polymer composition having high sensitivity and a high residual film ratio in an unexposed area, and a method for producing a relief pattern. SOLUTION: (a) General formula (I) (Wherein, R 1 represents a tetravalent organic group, R 2 represents a divalent organic group having a carboxyl group or a phenolic hydroxyl group, and R 3 represents a monovalent organic group). A polyamic acid ester having a unit, (b) an o-quinonediazide compound and (c) a general formula (II) (Wherein R 4 and R 5 represent alkyl groups) and a heat-resistant photosensitive polymer composition containing the compound represented by the formula A method for producing a relief pattern including a drying step, an exposing step, a developing step, and a heat treatment step. |