http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10237161-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 |
| filingDate | 1997-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1122f8f8e63aceea57ba00981791f6ce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cbccb9eccd9343e01da73d400cd58b7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a3b0f44612423feddbbb75a15674f66 |
| publicationDate | 1998-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10237161-A |
| titleOfInvention | Epoxy resin composition |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in resin filling property when encapsulating a semiconductor with a resin, has excellent solder resistance, and also has excellent product quality stability, and the epoxy resin composition. An object of the present invention is to provide a semiconductor device sealed with an object. The epoxy resin composition comprises an epoxy resin (A), a phenolic curing agent (B), a tetrasubstituted borate of an amidine compound as a curing accelerator (C), and an inorganic filler (D). The system curing agent (B) contains the compound represented by the general formula (I), and the inorganic filler (D) is 86 to 90% of the entire epoxy resin composition. 95% by weight of an epoxy resin composition represented by the formula: R 3 -(-CH 2 -R 1 -CH 2 -R 2- ) n -CH 2 -R 1 -CH 2 -R 3 (I) (wherein R 1 is a divalent aromatic group having no hydroxyl group, R 2 is a divalent aromatic group having a hydroxyl group, R 3 is a monovalent aromatic group having a hydroxyl group, n Represents 0 or an integer of 1 or more.) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9942449-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6495270-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7544727-B2 |
| priorityDate | 1997-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.