| abstract |
PROBLEM TO BE SOLVED: To be suitable for use of an exposure light source of 250 nm or less, especially 220 nm or less, and to be 250 nm or less, especially 220 nm or less. An object of the present invention is to provide a positive photosensitive composition which gives good sensitivity, resolution and a resist pattern when using an exposure light source of nm or less, and which shows sufficient dry etching resistance. SOLUTION: The compound which generates an acid upon irradiation with actinic rays or radiation, and at least one of a monovalent polycyclic alicyclic group having a specific structure are decomposed by the action of an acid to form an alkali developing solution. Positive photosensitive composition containing a resin having a group that increases the solubility in water. |