http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1022024-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0433 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 |
| filingDate | 1996-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05fd59bf881fa88692d6e736f0644c0e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_225827f4315533c9c1b81ceeaf2cbc74 |
| publicationDate | 1998-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H1022024-A |
| titleOfInvention | Semiconductor element inspection socket |
| abstract | (57) [Summary] [Object] To provide a semiconductor device inspection socket which has a small number of parts, has a simple structure, has a large degree of freedom in circuit board design and the like, and has excellent high frequency characteristics. A mounting recess is formed in a socket main body for positioning and mounting a semiconductor package in a detachable manner. The socket main body is positioned and mounted on a circuit board, and a connection portion fixed to a base film is formed. 42a, the connection guide piece 42 is integrated with the loading recess 31. A lead frame 40 extending inwardly and an elastomer connector 50 formed by diagonally penetrating a plurality of fine metal wires 52 in a thickness direction in an elastomer sheet 51 are connected to the socket body 30. The lead 12 of the semiconductor package 10 inserted in a predetermined position between the semiconductor package 10 and the circuit board 20 at a predetermined position. Is brought into contact with the connection lead 42 of the lead frame 40, and the lead 12 of the semiconductor package 10 is connected to the electrode 21 of the circuit board 20 through the connection lead 42 of the lead frame 40, the connection part 42 a and the thin metal wire 52 of the elastomer connector 50. Configured to connect. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9030222-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7511375-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8589743-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0004610-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100513941-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6969262-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004047336-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010073698-A |
| priorityDate | 1996-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.