http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10212394-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1997-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46d629aa4ab54ad4a02157a208559194 |
| publicationDate | 1998-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10212394-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which improves voids, improves solder crack resistance, and achieves both moldability and reliability. SOLUTION: Epoxy resin, phenol resin curing agent, An epoxy resin composition for semiconductor encapsulation comprising, as essential components, a curing accelerator, an inorganic filler, and a silicone oil containing an alkoxysilane group or an alkoxy group, an alcoholic hydroxyl group and a polyether group. |
| priorityDate | 1997-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.