http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10212340-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1997-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df469e03e17d79948900be7f5483f74a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f457e4863b726b8adda7554069a8f7a |
| publicationDate | 1998-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10212340-A |
| titleOfInvention | Curable epoxy resin composition |
| abstract | (57) Abstract: A liquid or solid curable epoxy resin composition at room temperature, characterized in that it contains 0.1 to 300 parts by weight of alkenyl salicylic acid based on 100 parts by weight of epoxy resin. Curable epoxy resin composition. According to the present invention, the cured product has a sufficient curing rate, a high uniformity of composition, no leaching by unreacted substances in the obtained cured product, flexibility, high thermal characteristics, and An excellent curable epoxy resin composition capable of imparting moisture absorption resistance can be provided. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002138130-A |
| priorityDate | 1997-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 314.