| abstract |
(57) Abstract: An epoxy resin composition having excellent adhesion and reliability while miniaturizing and improving the performance of a resin-encapsulated semiconductor device, and a semiconductor device encapsulated with the epoxy resin composition. To provide. SOLUTION: This semiconductor device comprises a semiconductor element 1, a substrate 2 on which the semiconductor element is mounted, and an epoxy resin composition 3 for encapsulating the semiconductor element. A resin-encapsulated semiconductor device, wherein the epoxy resin composition is molded, wherein the epoxy resin composition comprises an epoxy resin (A), a curing agent (B), A resin-sealed semiconductor device containing an inorganic filler (C) and a polyolefin (D) having a functional group having an oxygen atom or a nitrogen atom. |