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filingDate 1997-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1998-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10206462-A
titleOfInvention Method of manufacturing probe structure
abstract PROBLEM TO BE SOLVED: To provide a method of manufacturing a probe structure capable of manufacturing a probe structure having a bump contact with a small variation in height, which can make the pitch of bump contacts finer. is there. SOLUTION: An insulator layer 2 provided with a conductive circuit 3 on any surface or inside thereof and a metal layer (5, 6) are electrically connected to the metal layer (5, 6). A probe by a step of laminating so as to be connected and a step of forming a bump contact 4 by etching the metal layer (5, 6) so that a part of the metal layer (5, 6) remains as the bump contact 4. Structure 1 is manufactured.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010038777-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013137243-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006250552-A
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