http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10204265-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-56 |
| filingDate | 1997-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d07805b03adcdbc9a01781d3113d23b |
| publicationDate | 1998-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10204265-A |
| titleOfInvention | Epoxy resin composition and semiconductor encapsulation device |
| abstract | PROBLEM TO BE SOLVED: To provide a good moldability, less influence of moisture absorption, and particularly excellent in moisture resistance after solder bath immersion and solder heat resistance, and a sealing resin and a semiconductor package or a sealing resin and a lead frame. An epoxy resin composition and a semiconductor encapsulation device which are free from peeling off and internal resin cracks are provided. (A) Biphenyl type epoxy resin, (B) a phenolic resin, (C) an aminoalkyl titanate-based coupling agent, (D) a fused silica powder having a maximum particle size of 100 μm or less, and (E) a curing accelerator as essential components. An epoxy resin composition containing the fused silica powder of (D) in a ratio of 25 to 90% by weight based on the whole resin composition, and a cured product of the epoxy resin composition is used to obtain a semiconductor chip. Is a semiconductor sealing device that is sealed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016079317-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016079318-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030075949-A |
| priorityDate | 1997-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.