http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10204152-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eece3f4c4266dfce4fc469ddcb3eb4e9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1997-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdc3cec5ad8df54f08c6d0a81839e632 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edb55917fe2367c06195a9b1ef76b24b |
| publicationDate | 1998-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10204152-A |
| titleOfInvention | One-pack type epoxy resin composition |
| abstract | (57) [Summary] [Problem] A one-part room temperature moisture-curable epoxy resin composition having excellent storage stability, a high curing rate when taken out of a container, and useful as an adhesive or a sealing material in the civil engineering and construction fields. Offer. Kind Code: A1 A polyepoxy compound having at least two or more epoxy groups in a molecule, and a one-pack normal-temperature moisture curing method containing 0.01 mol% or more of phosphite triester with respect to the epoxy group of the polyepoxy compound. Epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6528595-B1 |
| priorityDate | 1997-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.