| abstract |
PROBLEM TO BE SOLVED: To provide a conductive material for bonding a semiconductor element having a long pot life, capable of being hardened by either in-line method or batch method, having sufficient curability and adhesive strength, generating less bubbles during curing, and having a long pot life. Provide a resin paste. SOLUTION: Silver powder, an epoxy resin, a phenol having at least two hydroxyl groups in one molecule, an organic phosphorus compound salt, and an organic solvent are essential components. 0.9 to 30% by weight of a phenol having at least two hydroxyl groups therein, 0.01 to 10% by weight of an organic phosphorus compound salt, and 1.10% by weight of an organic solvent. A resin paste for bonding a semiconductor element, which is contained in an amount of 0 to 10% by weight. |