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publicationDate 1998-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10182858-A
titleOfInvention Prepreg and laminate
abstract (57) [Abstract] [Problem] High heat resistance and electrical insulation reliability under moisture absorption. Further, there is provided a prepreg capable of obtaining a laminated board or a printed wiring board having a small variation in coefficient of thermal expansion and thickness, and having good formability. SOLUTION: The wholly aromatic polyester fiber has a density of 0. A non-woven fabric of 4-0.8 g / cm 3 is formed. The non-woven fabric is impregnated with 40 to 70% by weight of resin based on the total weight. A wholly aromatic polyester fiber having a much lower moisture absorption than aramid fiber is used.
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