http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10180403-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S525-922 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 |
| filingDate | 1996-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50a91c9eeddb59455ae0a4466ebec98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d19d3b15a3e9b71104610ecec54ab30a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55ddee279dfc822afe147a87c20d6b93 |
| publicationDate | 1998-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10180403-A |
| titleOfInvention | Resin composition, permanent resist resin composition and cured product thereof |
| abstract | PROBLEM TO BE SOLVED: To provide a permanent that has high resolution, is easy to develop with an alkaline aqueous solution, and has excellent plating solution resistance to electroless plating performed for a long time under high temperature and high alkalinity conditions. Provide resist. Further, it is possible to manufacture a printed wiring board having heat resistance that can withstand a temperature of about 260 ° C. in the soldering process. SOLUTION: The present invention comprises the following components (a), (b), (C), (d) and (e) a resin composition characterized by being an essential component, and a permanent resist resin composition for printed wiring boards. (A) a polyfunctional epoxy resin having an epoxy equivalent of 120 to 500, (b) a modified phenol novolak obtained by reacting 20 to 60% of phenolic hydroxyl groups with glycidyl acrylate or glycidyl methacrylate, (c) an epoxy acrylate or epoxy methacrylate compound, (D) a diluent comprising a photo-functional monomer, and (e) a photopolymerization initiator. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015166437-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002308956-A |
| priorityDate | 1996-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.