| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate |
1997-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_136fc528500f1d097502dc0e371a4fe5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e36d3c54a5c00df512214bc26c70eb37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d8bdadb15248026e854a64972c74eba |
| publicationDate |
1998-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10178070-A |
| titleOfInvention |
Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same |
| abstract |
(57) Abstract: The present invention provides a thermosetting adhesive composition for semiconductor devices excellent in reflow resistance and thermal cycling properties, and an adhesive sheet for semiconductor devices using the same, which is industrially provided. The reliability of a semiconductor device for use. A semiconductor integrated circuit for forming an adhesive layer of a substrate for a semiconductor integrated circuit having at least one layer of a wiring substrate including an insulator layer and a conductor pattern, a layer having no conductor pattern formed thereon, and an adhesive layer. An adhesive composition, wherein the adhesive composition is a thermosetting adhesive containing an epoxy resin (A), a thermoplastic resin (B), and aluminum hydroxide (C). An adhesive composition for a semiconductor device and an adhesive sheet for a semiconductor device. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100800214-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8119737-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008193105-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008187189-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002212525-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7947779-B2 |
| priorityDate |
1996-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |