http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10176033-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
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filingDate 1996-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b7b0b86be63f35f6579c32970db7f12
publicationDate 1998-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10176033-A
titleOfInvention Epoxy resin composition
abstract (57) [Problem] To provide an epoxy resin composition capable of obtaining a semiconductor device excellent in long-term reliability at a high temperature. SOLUTION: An epoxy resin having at least two or more epoxy groups in one molecule, a phenol resin having at least two or more phenolic hydroxyl groups in one molecule, and at least one metal selected from lanthanoids. Antimony trioxide composition doped with 0.1 to 10 parts by weight based on 100 parts by weight of antimony trioxide crystal, halogenated epoxy resin having at least two epoxy groups in one molecule, inorganic filler, and curing An epoxy resin composition for semiconductor encapsulation comprising an accelerator.
priorityDate 1996-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.