http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10168162-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1996-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
| publicationDate | 1998-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10168162-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [Problem] To provide a resin composition capable of obtaining a semiconductor device having few voids and excellent solder crack resistance. SOLUTION: Epoxy resin, phenol resin curing agent, An epoxy resin composition for semiconductor encapsulation comprising a curing accelerator, an inorganic filler, and a silicone oil having an alkoxysilane group and an alcoholic hydroxyl group as essential components. |
| priorityDate | 1996-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.