| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-7485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B7-7461 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
1996-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1db7d1b2d5c754e4c7eeaec5aefc220
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bc5ab0f0cb4928fbf005b57cf18b87f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c27da7d1eae0a6ab7a15a508e2466f7 |
| publicationDate |
1998-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10163236-A |
| titleOfInvention |
Manufacturing method of granular semiconductor sealing material |
| abstract |
PROBLEM TO BE SOLVED: To knead a resin component and an inorganic filler, and then pulverize the pulverized material 1 obtained by substantially kneading the mixture without substantially applying pressure. After heating and melting, Provided is a method for producing a granular semiconductor encapsulating material which is produced by cooling to granulate, and which is excellent in productivity. SOLUTION: A method of heating and melting a resin component is a method of heating and melting a pulverized material 1 under reduced pressure. Also, This is a method in which a heated gas is supplied to the pulverized material to melt it. Further, it is a method in which a pulverized material is passed through a heated space to be melted. |
| priorityDate |
1996-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |