http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10158489-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f8cfa5aee4410611b5c562275c9f8e3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02 |
| filingDate | 1996-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd950c23c540274892612f03f577a7ce |
| publicationDate | 1998-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10158489-A |
| titleOfInvention | Materials for heat-resistant electronic components |
| abstract | (57) [Problem] To provide an electronic component material made of polyester and polyamide and having excellent moldability, strength, heat resistance, and copper wire corrosion resistance. SOLUTION: (A) A weight ratio of polybutylene terephthalate to polyethylene terephthalate is 30 / 70- 10/90 polyester resin mixture, (B) polyamide resin, (C) compound having carbodiimide structure, (D) inorganic or organic filler, (A) And the weight ratio of component (B) is (A) / (B) = 65 / 35 to 90/10, and 0.1 to 1.0 parts by weight of the component (C) and 25 to 150 parts by weight of the component (D) based on 100 parts by weight of the total of the components (A) and (B). A material for heat-resistant electronic components. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7291683-B2 |
| priorityDate | 1996-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.