http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10158480-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1996-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6359d25410ed86f5dded0a644005a11f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08ac9716e7d302830be438e262f25424 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aae35393c797d299838a5d1484cddb96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f73c4c24267354c5c06b8d409fadf421 |
| publicationDate | 1998-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10158480-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract | (57) Abstract: An epoxy resin composition for semiconductor encapsulation which does not require pre-processing when mounted on an electronic device, and which is resistant to heating during solder mounting and has excellent low stress properties, and this epoxy resin. Provided is a semiconductor device which is sealed with a composition and has excellent reliability at the time of solder mounting. A semiconductor element is encapsulated using an epoxy resin composition for encapsulating a semiconductor, comprising the following components (A) and (B) as main components and also containing the following components (C) and (D): I do. (A) Biphenyl type epoxy resin. (B) a phenolic resin. (C) an organic phosphorus compound. (D) metaboric acid. |
| priorityDate | 1996-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.