http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10158361-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 1996-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c67c423fde48a9b2e4675994d8b841a |
| publicationDate | 1998-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10158361-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [Summary] [PROBLEMS] To significantly improve the soldering resistance at the time of surface mounting and improve the moldability such as curability and fluidity by improving the adhesion to members such as chips and lead frames. To provide an epoxy resin composition for semiconductor encapsulation which is excellent and free from voids. SOLUTION: An epoxy resin containing the epoxy compound represented by the general formula (1) in an amount of 20 to 100% by weight in the total epoxy resin, and a phenol resin curing agent represented by the general formula (2) in the total phenol resin curing agent is contained in the total phenol resin curing agent. An epoxy resin composition for semiconductor encapsulation comprising a phenol resin curing agent containing up to 100% by weight, a specific polysiloxane compound, an inorganic filler, and a curing accelerator. Embedded image (R 1 in the formula is hydrogen, a chain or cyclic alkyl group having 1 to 6 carbon atoms, a phenyl group, a group selected from halogen, or an atom. May be used.) (In the formula, 0 ≦ n ≦ 4.) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023120739-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011046966-A |
| priorityDate | 1996-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.